Gold-tin (AuSn) reflow bonding experiment service
We will solve your problems with experiments using AuSn (high-temperature solder).
Soldering with AuSn is used for joining electronic components that require high reliability. It has many advantages, such as utilizing its high melting temperature characteristics and being usable as an initial joining material when attempting to join materials. However, there are some difficulties compared to conventional soldering, such as: - Processing in areas exceeding 300°C - Need for atmosphere management during solder melting, such as in an N2 environment - The surface condition of the joined objects is influenced by the composition of the plating - Difficulty in positioning the workpiece during connection, etc. Our company has experience in mass production for optical pickups and communication LDs for major manufacturers. Through this experience, we have addressed many customer issues through prototyping. 【Service Features】 - Support including substrate design and joining jig design - For LED flicker chips, we can perform joining not only with non-flux but also with flux - We also have AIN submounts, LEDs, and packages in stock as experimental materials Please feel free to consult us if you have urgent experimental needs or any other concerns.
- Company：佐用精機製作所
- Price：Other
